Surface Mount Backflow Soldering Machine

Product Code LTEKCTLB-PB91-0017

Description & Specification

Surface Mount Backflow Soldering Machine

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Categories: PCB Lab Equipment

Tags: Surface Mount Backflow Soldering Machine

Technical Specifications

Technical Parameters:

Equip with nitrogen protection connector, and use nitrogen to make protection.

Soldering zone use fuzzy control technology, you can only set 3 units of technical parameter, then you can control the whole temperature curve, and you can follow temperature change, blue backlight LCD display.

In welding process, PCB is in static state/ The surface components should be in correct position, and avoid not be soldering.

Soldering zone use far infrared ray heat, and high temperature motor force to be heated.

The soldering machine can be connected to PC, and use backflow curve to record save software.

It use 320×240mm dot matrix high resolution LCD display, the dimension of LCD is 113mm Dot matrix high resolution LCD80mm.

The welding machine has 4 ways temperature sensor interface, sensor head is PT100, it can correct welding temperature curve through backflow analysis

Peak power: 3.5KW

Dimension: 600×450×500mm

Why choose LTekOnline

Trusted Surface Mount Backflow Soldering Machine Manufacturer & Supplier

LTekOnline are the manufacturers of Surface Mount Backflow Soldering Machine used to demonstrate engineering principles in Engineering Colleges, Engineering Schools, and PCB Lab Equipment for Engineering Teaching Lab in Universities. We supply Surface Mount Backflow Soldering Machine to TVET institutes, vocational training centres, polytechnics and research labs across more than 90 countries, with quality testing technology, comprehensive operation manuals and full after-sales support.