Tin Lead Plating Machine

Product Code LTEKCTLB-PB91-003

Description & Specification

Tin Lead Plating Machine

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Categories: PCB Lab Equipment

Tags: Tin Lead Plating Machine

Technical Specifications

Double sides, multi layer circuit board etc. non-metal material double side drilling hole protection.

Cathode oscillation technology, prevent concentration gradient, add hole liquid flow. Swing time:3-5 times/minute.

Full ABS engineer plastic machine and inner groove, antiseptic, anti high temperature, anti vibration, technology flow is good, outlook is beautiful.

Technical Specification:

Minimum hole:0.6mm

Max thickness diameter ratio, 3:1

Max panel:400×400mm, it can electroplate for 5 boards at the same time.

Dimension:420×430×420mm

Output voltage:0-15V,adjustable continuously

Output current:0-20A, adjustable continuously.

Why choose LTekOnline

Trusted Tin Lead Plating Machine Manufacturer & Supplier

LTekOnline are the manufacturers of Tin Lead Plating Machine used to demonstrate engineering principles in Engineering Colleges, Engineering Schools, and PCB Lab Equipment for Engineering Teaching Lab in Universities. We supply Tin Lead Plating Machine to TVET institutes, vocational training centres, polytechnics and research labs across more than 90 countries, with quality testing technology, comprehensive operation manuals and full after-sales support.